The University of Texas at Austin

Interconnect & Packaging Research Group

Home Research Facilities People Publications Courses Links

Ho Group Image

The Interconnect & Packaging Laboratory is located at the J. J. Pickle Research Campus and is part of the Microelectronics Research Center, the Mechanical Engineering Department and the Texas Materials Institute of The University of Texas at Austin.

Director: Dr. Paul S. Ho / PRC-MER 2.206D / 512.471.8961 / 512.471.8969 Fax

Admin Associate: JoAnn Smith / PRC-MER 2.206D / 512.471.8996 / 512.471.8969 Fax

Address
Pickle Research Center,
MER Bldg. 160  Room 2.206D
Campus Mail Code: R8650
Austin, TX 78758
Postal Mailing Address
Interconnect & Packaging Group
Univ. of Texas, PRC/MER
Mail Code: R8650
Austin, TX 78712-1100
Express Mail Delivery
Interconnect & Packaging Group
Univ. of Texas, PRC, Bldg. 160
10100 Burnet Road
Austin, TX 78758

 

 © 2006-2008 Interconnect and Packaging GroupThe University of Texas at Austin
  Last update: 05-11-2011 | Contact: Webmaster